Laser Services

We provide a wide variety of laser services including:

Semiconductor Wafer Drilling & Routing
Semiconductor Wafer Dicing
Semiconductor Wafer Patterning
Printed Circuit Board Blind Microvia Drilling
Printed Circuit Board Image Patterning
Printed Circuit Board Panel Shorts Repair
Printed Circuit Board Tight Tolerance Routing
Special Materials (Teflon and Duroid) Drilling and Routing
Soldermask on Pad Repair (Skiving)
Flexible Circuit Coverlayer and Contour Routing
Flexible Circuit Backside Opening (Skiving)
and Other UV Laser Applications upon request